m********u
发帖数: 3942 | 1 地点San Jose, CA
DESCRIPTION
Join the development of all the circuits in both board level and IC level,
and sub-system in HMI e-beam wafer inspection tools. The position is focused
on analog and mixed signal circuit design and circuit simulation in both
board level and IC level, print circuit board (PCB) layout, PCB prototyping,
tuning and debugging, ASIC tapeout, pilot production, and technical
document writing. The position may be involved in but not limited to the
design works listed as follows.
Ultra low noise high efficient power supplies: voltage and current source
Low noise high voltage power supply
Low noise high voltage amplifier
Ultra low noise high gain wideband amplifier
Variable gain amplifier
Client and DAC application
Grounding and shielding design at both PCB level and module level
Signal integrity and power integrity design at both PCB level and module
level
Analog and mixed signal ASIC design and tapeout
Analog and mixed signal ASIC PCB level integration
REQUIREMENTS
Ph.D with 2+ years of hands-on experiences, or master with 5+ years hands-on
experiences, or bachelor with 8+ years hands-on experiences, in electrical
engineering or related fields. Hands-on experiences of schematic capture,
schematic level simulation, PCB layout, PCB level simulation, prototyping,
and problem solving. Familiar with test equipments such as multi-meter, SMU,
signal / function generator, oscilloscope, signal / spectral analyzer, and
network analyzer. The successful candidate should be a team player and
should have self motivation, initiative, dedication, and strong
communication skills.
The candidate should also have at least six of the following
specific skills or experiences.
OPA circuit (board level) design and building experiences and / or OPA IC
design with tapeout experiences. OPA application experiences
High speed voltage comparator IC design with tapeout experiences and / or
high speed voltage comparator application experiences.
Signal conditioning circuits design and building experiences for test
equipments, including but not limit to wide band voltage amplifier, wide
band current amplifier, wide band transimpedance amplifier, Client driver,
and cable driver
Variable gain amplifier circuit (board level) design and building
experiences and / or Variable gain amplifier IC design with tapeout
experiences
Wide band analog switch (board level) design and building experiences and /
or wide band analog switch IC design with tapeout experiences
High speed Client and DAC IC design with tapeout experiences. Client IC and
DAC IC application experiences
Class D amplifier circuit design and building experiences
Switching mode power supply circuit and / or linear power supply circuit
design and building experiences
High accuracy voltage or current reference circuit (board level) design and
building experiences and / or high accuracy voltage or current reference IC
design with tapeout experiences
RF circuit (board level) design and building experiences and /or RF IC
design with tapeout experiences
Mixed signal circuit (board level) design and building experiences and / or
mixed signal IC design with tapeout experiences
Image sensor IC design and tapeout experiences.
Knowledge of device physics for the semiconductor devices such as PIN and
APD for charged particle detection; BJT, JFET and MOSFET for both switch
mode and linear operation
Component test, screen, characterization (including passive and active
devices) and model extraction
Knowledge and experiences in Board level and module level shielding and
grounding; knowledge and experiences in signal integrity and power integrity
Thick film circuit design and building experiences
Semiconductor device packaging design experiences
Thermal design for electronic device and / or module |
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