looking for candidate to fill a full time position in Qualcomm, San Diego.
Pls email resume ASAP to j*****[email protected] if you meet the requirements. Pls
, serious applicants only
Excellent experience in
1. CPI (Chip-package-interaction) development and qualification working
extensively with Fab and assembly houses
2. FBEOL and bumping process
3. thermal compression bonding and stress simulation definitely a plus
