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发帖数: 73 | 1 Please Note job opening is for PHD RCG (18 month prior or post graduation
date) only.
Candidates with chem, polymer, materials science background are encouraged
to apply.
Please reply to mailbox for further inquiry.
Description
Job Description: Packaging Engineers provide package development and
sustaining support for integrated circuit or semiconductor assemblies,
various other electronic components and/or completed units. Conducts tests
and research on basic materials and properties. Establishes material
specifications for contract assemblers and raw material vendors and
interfaces with Quality Assurance and Purchasing regarding material quality
and vendor performance. Provides consultation concerning packaging problems
and improvements in the packaging process. Responds to customer/client
requests or events as they occur. Develops solutions to problems utilizing
formal education and judgement.
Qualifications
You must possess a Ph. D. in Material Science or a Master of Science degree
in Material Science with more than two years of relevant working experience
. Additional qualifications include:
- Excellent working experience in handling analytical tools
- Working experience in relationship between processing vs. microstructure
vs. mechanical and physical properties of materials (polymers, composites,
metals and ceramics)
- Working knowledge in fracture and adhesion mechanisms of materials and
material interfaces
- Working knowledge in fundamentals of materials science and engineering
- Excellent knowledge in metal solidification process/phase diagrams,
polymerization, deformation of materials, and material development
- Good problem-solving, data analysis, statistical design, and analysis
skills
- Good communication skills
- Ability to work in a team environment across multi-geographies
- Ability to travel overseas extensively
Job Category
Primary Location
Organization
Full/Part Time |
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