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发帖数: 1 | 1 Hi, all
I am an electronic engineering student. My project is about microsystem
packaging. Now I am dealing with material stress, strain problems, especially
stress on interface between 2 different kinds of material induced by thermal
mismatch or other causes. I am doing some ANSYS simulations now. I want to
know about physics principle behind. But I know little about mechanical
problem. Can you guys recommend some books about mechanics? Thanks a lot! |
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