z***k 发帖数: 11 | 6 Memory组招人
In this position, you will be working as a member of the Non-Volatile Memory
(NVM) Solutions Group's (NSG's) Technology Development Quality and
Reliability (TD Q&R) team, helping to develop new state-of-the-art Intel NVM
technologies and SSD products - focusing on NVM array reliability:
degradation of key array parameters due to program and/or erase cycling, and
various data retention and/or disturb mechanisms. The work will involve
activities such as designing and executing experiments to characterize NVM
array reliability mechanisms, physical (device physics based) and empirical
reliability modeling, field failure rate estimation, and help develop design
and/or process and/or product and/or test solutions in order to enable
aggressively scaling of the Intel's NVM technologies, including exploration
of novel memory cells. You will be expected to lead small cross-functional
groups of engineers on technical projects. You must possess the below
minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the minimum requirements and are
considered a plus factor in identifying top candidates. Experience listed
below would be obtained through a combination of your school work/classes/
research and/or relevant previous job and/or internship experiences.
Minimum Qualifications: The candidate must possess a Master of Science or Ph
.D. degree in Electrical Engineering, Computer Engineering, Materials
Science, Physics or Information Systems. Candidate must have 6 months of
work or educational experience in the following:
• Semiconductor device physics, materials properties, probability and
statistics, electrical circuits, semiconductor processing, and quantum
physics
• Experience in hands-on experimental design, execution, analysis,
interpretation and synthesis
• Programming (C or C and PERL or Python)
Preferred Qualifications:
• Prior Intel Intern or Scholarship recipient
• non-volatile memories, especially product or reliability
• Imaging and analytical lab test equipment such as Logic analyzer/
oscilloscopes, semiconductor parametric analyzer (CV-IV), memory testers.
• Reliability failure statistics, physics, or failure mechanisms.
• CMOS transistor level circuit design, semiconductor device physics,
memory reliability, interconnect reliability, computer or digital systems,
or board level design.
• Statistical analysis packages (e.g. JMP or Minitab)
• Computer programming for testing, preferably of memories , and data
acquisition, reduction and analysis
• Semiconductor fabrication process, packaging assembly, and/or board
system technology operations |