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发帖数: 2934 | 1 Title: High performance encapsulants for ultra high-brightness LEDs
Author(s): Mosley David W.; Auld Kathy; Conner David; et al.
Editor(s): Streubel KP; Jean H
Conference: 12th Conference on Light-Emitting Diodes - Research,
Manufacturing, and Applications XI Location: San Jose, CA Date: JAN 22-24,
2008
Sponsor(s): SPIE
Source: LIGHT-EMITTING DIODES: RESEARCH, MANUFACTURING, AND APPLICATIONS XII
Book Series: Proceedings of SPIE Volume: 6910 Article Number: 691017
DOI: 10.1117/12.761724 Published: 2008
Times Cited: 1 (from Web of Science)
Title: Development of microelectronic grade silicone materials for chip
scale packages
Author(s): Benson EJ; Dent SJ; Norris AW; et al.
Book Group Author(s): SMTA
Conference: 5th Annual Pan Pacific Microelectronics Symposium Location: ISL
MAUI, HI Date: JAN 25-27, 2000
Sponsor(s): Surface Mount Technol Assoc; GPD
Source: FIFTH ANNUAL PAN PACIFIC MICROELECTRONICS SYMPOSIUM, PROCEEDINGS
Pages: 290-295 Published: 2000
Times Cited: 0 (from Web of Science)
Title: Development of UV Stable LED Encapsulants
Author(s): Lin Chih-Hau; Li Hsun-Tien; Huang Shu-Chen; et al.
Book Group Author(s): IEEE
Conference: 4th International Microsystems, Packaging, Assembly and Circuits
Technology Conference Location: Taipei, TAIWAN Date: OCT 21-23, 2009
Sponsor(s): IEEE CPMT-Taipei; ITRI; IMAPS-Taiwan; I-Shou Univ; SIPO; SMTA;
TPCA
Source: IMPACT: 2009 4TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND
CIRCUITS TECHNOLOGY CONFERENCE Pages: 494-496 Published: 2009
Title: Development of High-Performance Optical Silicone for the Packaging of
High-Power LEDs
Author(s): Lin Yeong-Her; You Jiun Pyng; Lin Yuan-Chang; et al.
Source: IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES Volume:
33 Issue: 4 Pages: 761-766 DOI: 10.1109/TCAPT.2010.2046488 Published
Times Cited: 0 (from Web of Science)
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