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发帖数: 88 | 1 AMD is hurry in looking for a Ph.D level people with background in ME on
electronics cooling. Will deal with component and system level thermal
solution development of high power microprocessors.
Desired skills:
Thermal modeling using those stupid icepak & flothem tools.
Experimental skills in thermal & electrical measurement.
Deep understanding of heat transfer from mechanical, electrical, and
material science point of view.
This position needs to be filled in two months.
Let me know if you are interested. |
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