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d***a
发帖数: 73 | 1 We have several position openings at Intel Chandler AZ for microelectronic
packaging materials development. Please note the position is for recent
college graduate only (within 18 month of graduation). If you are interested
, please respond via mitbbs site email.
thx.
Job Description
Description
Job Description: Microelectronic Packaging Engineers provide project
management, package design/development and sustaining support for integrated
circuit or semiconductor assemblies, various other electronic components
and/or completed units. Defines overall package performance and
specification and realizes technology certification through layout design
and test vehicle design. Conducts tests and research on basic materials and
properties. Establishes material specifications for contract assemblers and
raw material vendors and interfaces with Quality Assurance and Purchasing
regarding material quality and vendor performance. Provides consultation
concerning packaging problems and improvements in the packaging process.
Responds to customer/client requests or events as they occur. Develops
solutions to problems utilizing formal education and judgment.
Qualifications
- Candidate should possess a Ph.D. in Materials Science, Chemistry, Polymer
Science, Chemical Engineering, or any other electronics packaging related
field.
Additional qualifications include:
- Strong background and understanding in polymer materials-structure
property relationships and impact on package performance.
- Experience in adhesion mechanisms of materials and material interfaces is
preferred.
- Understanding in photochemistry and materials used in photoresist is a
plus.
- Prior cleanroom (process and equipment) experience is a plus.
- Good knowledge on basic Statistical Process Control (SPC) and/or Design of
Experiments (DOE) principles
- Demonstrated technical problem solving skills. Good listening, written and
verbal communication skills.
- Ability to lead and influence both external and internal teams, and work
independently without much supervision.
Business Group
As the world's largest chip manufacturer, Intel strives to make every facet
of semiconductor manufacturing state-of-the-art -- from semiconductor
process development and manufacturing, through yield improvement to final
test and optimization, and lastly packaging. Employees in the Technology and
Manufacturing group are part of a worldwide network of manufacturing and
assembly/test facilities. |
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