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发帖数: 896 | 1 【 以下文字转载自 EE 讨论区 】
发信人: heartaway (9527), 信区: EE
标 题: job opening - Packaging Development Engineer
发信站: BBS 未名空间站 (Thu Feb 10 17:13:28 2011, 美东)
If your background matches this position, please send me your resume
(email needed).
========================
Job Posting: Jan 6, 2011
Primary Location: US-AZ-Tempe (AZ34)
Job: Packaging
Education Level: Bachelor's Degree
Job Type: Experienced
Qualifications:
-BS in Materials Engineering/Related with 5 years experience in
semiconductor packaging or related field required. MS/PhD with experience
preferred.
-Specific knowledge in multi-chip module (MCM) assembly, wafer level
packaging or 3D advanced packaging is highly preferred.
-An experienced, innovative, development minded engineer with a strong
material science background.
-Emphasis in materials selection and process development with a disciplined
approach to conducting experiments (DOE)
-Strong written and verbal presentation skills required. |
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