m*********r
发帖数: 1797 | 1 刚刚收到正式通知，以前在版上求过祝福（包子已发），回来报告背景回馈本版。
Timeline 04/18 efile received
04/22 pp received
04/27 approved
背景： US Phd in EE in 2009, working in a small high-tech company as senior
research engineer.
1 book chapter, 2 top journals, 10 top conference papers all first authors
citation 40+
review 60+ times for 3 top journals, 3 top conferences.
1 research award from university (added only to contributions)
Reference letters: 5 recommendation letters, 3 independent. 1 from big
company research CTO, 1 from US university, 1 from Italy, 1 from previous
phd boss and 1 from current company CEO. All big guys in my field (IEEE
fellows or ACM fellows)
Review testimony letters : 1 from top journal editor(US), 1 from top
conference chair (Potugal)
Claimed Reviews, Authorship and Contributions.
Really thanks those independent experts who provide me recommendation
letters, i never know them but when I contacted them, all of them replied
and response reasonably. I believe it is easier to get the letter since they
all cited my papers before. So when you look for references, better start
with people who cited your research.
Special thanks to my lawyer: Harry Houyi Wang. (i**[email protected]
713-471-8963) I have consulted 5 lawyers on the board, 2 said EB1A, 1 said
EB1B pretty good, 1 said EB1B reasonable and NIW, I finally chose Harry
since someone recommended him and he charges the least fee. He's very
patient and since he was formerly a scientist he understand more for us
scientist/engineer background. All email replied within a day and lots of
good advices.
I believe to make a case strong, one must show to the IO that his/her
research really has big impact on the research community around the world (
International influence ), my research was the foundation of a research
group in India and a joint group of US, China and Singapore. I also showed
numerous email inquiries from people around the world asking for my paper or
code. Just do more research yourself and you'll find your international
influences and show to IO.
Good luck guys with your petition and best wishes to my I485 application. | R*******d
发帖数: 13640 | | m*****q
发帖数: 1930 | 3 cong
senior
【在 m*********r 的大作中提到】
: 刚刚收到正式通知，以前在版上求过祝福（包子已发），回来报告背景回馈本版。
: Timeline 04/18 efile received
: 04/22 pp received
: 04/27 approved
: 背景： US Phd in EE in 2009, working in a small high-tech company as senior
: research engineer.
: 1 book chapter, 2 top journals, 10 top conference papers all first authors
: citation 40+
: review 60+ times for 3 top journals, 3 top conferences.
: 1 research award from university (added only to contributions)
| g**********8
发帖数: 20 | | q******2
发帖数: 1368 | | x*********i
发帖数: 932 | | f*******2
发帖数: 656 | | q**f
发帖数: 2903 | 8 RE
senior
【在 m*********r 的大作中提到】
: 刚刚收到正式通知，以前在版上求过祝福（包子已发），回来报告背景回馈本版。
: Timeline 04/18 efile received
: 04/22 pp received
: 04/27 approved
: 背景： US Phd in EE in 2009, working in a small high-tech company as senior
: research engineer.
: 1 book chapter, 2 top journals, 10 top conference papers all first authors
: citation 40+
: review 60+ times for 3 top journals, 3 top conferences.
: 1 research award from university (added only to contributions)
| A*******n
发帖数: 725 | | l******t
发帖数: 2243 | 10 cong
发信人: minicoooper (冲刺), 信区: Immigration
标 题: EB1B TSC PP 5 day approved 背景介绍
发信站: BBS 未名空间站 (Wed May 4 09:51:21 2011, 美东)
刚刚收到正式通知，以前在版上求过祝福（包子已发），回来报告背景回馈本版。
Timeline 04/18 efile received
04/22 pp received
04/27 approved
背景： US Phd in EE in 2009, working in a small high-tech company as senior
research engineer.
1 book chapter, 2 top journals, 10 top conference papers all first authors
citation 40+
review 60+ times for 3 top journals, 3 top conferences.
1 research award from university (added only to contributions)
Reference letters: 5 recommendation letters, 3 independent. 1 from big
company research CTO, 1 from US university, 1 from Italy, 1 from previous
phd boss and 1 from current company CEO. All big guys in my field (IEEE
fellows or ACM fellows)
Review testimony letters : 1 from top journal editor(US), 1 from top
conference chair (Potugal)
Claimed Reviews, Authorship and Contributions.
Really thanks those independent experts who provide me recommendation
letters, i never know them but when I contacted them, all of them replied
and response reasonably. I believe it is easier to get the letter since they
all cited my papers before. So when you look for references, better start
with people who cited your research.
Special thanks to my lawyer: Harry Houyi Wang. (i**[email protected]
713-471-8963) I have consulted 5 lawyers on the board, 2 said EB1A, 1 said
EB1B pretty good, 1 said EB1B reasonable and NIW, I finally chose Harry
since someone recommended him and he charges the least fee. He's very
patient and since he was formerly a scientist he understand more for us
scientist/engineer background. All email replied within a day and lots of
good advices.
I believe to make a case strong, one must show to the IO that his/her
research really has big impact on the research community around the world (
International influence ), my research was the foundation of a research
group in India and a joint group of US, China and Singapore. I also showed
numerous email inquiries from people around the world asking for my paper or
code. Just do more research yourself and you'll find your international
influences and show to IO.
Good luck guys with your petition and best wishes to my I485 application.
【在 m*********r 的大作中提到】
: 刚刚收到正式通知，以前在版上求过祝福（包子已发），回来报告背景回馈本版。
: Timeline 04/18 efile received
: 04/22 pp received
: 04/27 approved
: 背景： US Phd in EE in 2009, working in a small high-tech company as senior
: research engineer.
: 1 book chapter, 2 top journals, 10 top conference papers all first authors
: citation 40+
: review 60+ times for 3 top journals, 3 top conferences.
: 1 research award from university (added only to contributions)
| | | y***9
发帖数: 1173 | | c*********o
发帖数: 1734 | 12 Big cong!
senior
【在 m*********r 的大作中提到】
: 刚刚收到正式通知，以前在版上求过祝福（包子已发），回来报告背景回馈本版。
: Timeline 04/18 efile received
: 04/22 pp received
: 04/27 approved
: 背景： US Phd in EE in 2009, working in a small high-tech company as senior
: research engineer.
: 1 book chapter, 2 top journals, 10 top conference papers all first authors
: citation 40+
: review 60+ times for 3 top journals, 3 top conferences.
: 1 research award from university (added only to contributions)
| S*V
发帖数: 789 | 13 cong
senior
【在 m*********r 的大作中提到】
: 刚刚收到正式通知，以前在版上求过祝福（包子已发），回来报告背景回馈本版。
: Timeline 04/18 efile received
: 04/22 pp received
: 04/27 approved
: 背景： US Phd in EE in 2009, working in a small high-tech company as senior
: research engineer.
: 1 book chapter, 2 top journals, 10 top conference papers all first authors
: citation 40+
: review 60+ times for 3 top journals, 3 top conferences.
: 1 research award from university (added only to contributions)
| s*******t
发帖数: 7746 | | o*********o
发帖数: 120 | 15 GX!
senior
authors
【在 m*********r 的大作中提到】
: 刚刚收到正式通知，以前在版上求过祝福（包子已发），回来报告背景回馈本版。
: Timeline 04/18 efile received
: 04/22 pp received
: 04/27 approved
: 背景： US Phd in EE in 2009, working in a small high-tech company as senior
: research engineer.
: 1 book chapter, 2 top journals, 10 top conference papers all first authors
: citation 40+
: review 60+ times for 3 top journals, 3 top conferences.
: 1 research award from university (added only to contributions)
| h*****i
发帖数: 1017 | | H*7
发帖数: 4894 | | K******g
发帖数: 1870 | |
|
