O***p
发帖数: 1333 | 1 我刚刚进入CFD的领域，没有用过像Flotherm或者Icepak复杂的软件，因为我是搞强电的
，我的老板对CFD方面也不懂，我想请问懂这方面的人哪个软件更适合模拟IC level，比
如几个芯片放在一些substrate上再用heat sink或者water cooling的温度反映。如果有
用过2者的，请做一下比较。多谢。 |
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O***p
发帖数: 1333 | 2 这里有没有人用过Flotherm或IcePak,可以谈谈经验么？
的
比
有 |
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m****y
发帖数: 14 | 3 我们组里有icepak，但我却没时间去摸
其实它就是Fluent的一个分支包装而已。
模块做的比较适合做封装的热设计。
Flotherm听说过，却没见过，但你说的
东西我觉得两者做都可以，很基本的一些
设计。 |
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Y***o
发帖数: 4135 | 4 Does ANSYS have a thermal analysis software for the electronics industry like
FLOTHERM??
Or where can I find Flotherm cracked version??
Thanks a lot |
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t*n
发帖数: 14458 | 5 why do you want ot do CFD?
there is no fluid flow involved in your problem i believe. pure heat conduction. |
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O***p
发帖数: 1333 | 6 CFD helps determin the convection HTC for the geometry. I did modeling in
Patran and I had to manually input the convection coefficient for the
geometry, which I hated so much because you know how difficult that is to do
with a finned heat sink, and when you have a pin-fin array heat sink, just
forget it.
Conduction only applies within the package. Convection and radiation is the
way to remove heat into ambient air. That's why I think CFD software is needed
conduction.
电的
，比
果有 |
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h****l
发帖数: 7290 | 7 计算热对流不简单的，搞电的还是不要自己算了，都不知道对错 |
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P*******9
发帖数: 113 | 8 ANSYS has thermal modeling function. If used for electronic cooling, its
function is not good.
Icepak and Flotherm are best. |
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j****x
发帖数: 943 | 9 On the contrary, I think FEM or FVM simulation and modeling using IcePak,
Flotherm or Fluent is a great plus for job hunting per se. It is true that
not many nanoscale heat transfer openings on the job market, however,
engineers in many electronics cooling related industries are hiring. If LZ
want to go for academia, I think these are not bad areas to delve into.
to
IcePak,
the |
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